ACM Research Announces Participation in 13th Annual NYC Summit 2024
FREMONT, Calif., Nov. 29, 2024 — ACM Research, Inc. (“ACM” or “ACM Research”) (NASDAQ: ACMR), a prominent supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, has officially announced its involvement in the 13th Annual NYC Summit 2024 investor conference. This significant event will take place on Tuesday, December 17, 2024, at Mastro’s Steakhouse in New York City.
The presentation materials utilized by ACM during the NYC Summit will be available on the events page of ACM’s website.
About the 13th Annual NYC Summit 2024
The NYC Summit is an investor conference that is collectively hosted and funded by various participating companies, featuring a unique “round-robin” format. This format allows for small group meetings between company management teams and attending investors and analysts. Throughout the event, attendees will have the chance to engage with the majority of the 18 management teams during these small group sessions, as well as network during breakfast and lunch.
The following 18 management teams will collectively participate in the 13th Annual NYC Summit 2024:
- ACM Research (ACMR)
- Advanced Energy (AEIS)
- Aehr Test (AEHR)
- Alpha & Omega Semiconductor (AOSL)
- Axcelis (ACLS)
- Cohu, Inc. (COHU)
- CVD Equipment (CVV)
- FormFactor (FORM)
- Ichor Systems (ICHR)
- inTEST Corporation (INTT)
- Kulicke & Soffa (KLIC)
- Lantronix, Inc. (LTRX)
- nLIGHT, Inc (LASR)
- Peraso, Inc. (PRSO)
- Photronics, Inc. (PLAB)
- QuickLogic (QUIK)
- SkyWater Technology (SKYT)
- Vishay Precision Group (VPG)
Stifel and TD Cowen are proud sponsors of the conference.
Attendance at the NYC Summit is strictly by invitation and is exclusively available to accredited investors and publishing research analysts. Due to limited space, early RSVP is encouraged; the last date for registration is December 10, 2024.
About ACM Research, Inc.
ACM Research develops, manufactures, and sells semiconductor process equipment crucial for single-wafer or batch wet cleaning, electroplating, stress-free polishing, and vertical furnace processes. These technologies play a vital role in advanced semiconductor device manufacturing and packaging. ACM is committed to delivering tailored, high-performance, and cost-effective process solutions that semiconductor manufacturers can utilize across various manufacturing stages to enhance productivity and product yield.
